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Wafer scribing

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The cutting efficiency of SiC and other high hardness materials is low, the tool wear is fast, and the notch is prone to edge collapse. The phenomena such as passivation of blade abrasive particles and blockage of pores lead to the increase of processing load, increase the cracking and burr of processed objects, and cause blade damage, abnormal wear and burn of processed objects. In order to prevent the occurrence of passivation of abrasive particles and blockage of pores, it is necessary to select the blade with easily worn binder, which will shorten the service life of the blade. In addition, the larger size of #320 ~#600 abrasive particles should also be used when selecting the size of abrasive particles. Ultrasonic vibration provides a new way to solve the above problems.

Through the ultrasonic transducer, the blade is driven to make radial telescopic vibration, so that the abrasive particles and the workpiece collide repeatedly under the state of high acceleration. While making the radial direction of the blade produce a small broken layer, it is processed. Therefore, the processing load of the blade can be greatly reduced. In addition, due to the ultrasonic vibration, there is a gap between the blade and the workpiece, which greatly improves the cooling effect of abrasive particles, prevents the occurrence of abrasive particle passivation and pore blockage, improves the processing quality and prolongs the service life of the blade.


 

 

Conventional scribing

Ultrasonic scribe

 Ultrasonic dicing brings the following advantages: improving cutting efficiency, improving tool service life and inhibiting edge collapse.


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